IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an experienced IC Package Design Engineer to join their innovative team. This role combines technical expertise with creative problem-solving to develop sophisticated package solutions for Apple's consumer electronic products.

As an IC Package Design Engineer, you'll be responsible for designing and implementing physical packages and modules for various chips, including SoC, Memory, RF, and cellular components. You'll work closely with multi-functional teams to optimize package performance across mechanical, electrical, and thermal dimensions.

Key Responsibilities:

• Lead package/SiP/module physical design, layout optimization, and tape out
• Coordinate with cross-functional teams on new product package feasibility analysis
• Define and develop design verification strategies
• Optimize package pin out and perform S-parameters extraction
• Drive methodology improvements and innovations in package design
• Partner with Silicon PD team for chip Floorplan optimization

The role offers competitive compensation ($166,600 - $296,300) and comprehensive benefits including medical/dental coverage, retirement benefits, stock programs, and education reimbursement. You'll be part of Apple's culture of innovation, working on products that millions of people use daily.

Required Qualifications:

• BS degree with 10+ years of relevant industry experience
• Strong fundamentals in electrical/material/thermal/mechanical engineering
• Experience with package design and Cadence Allegro or Mentor Xpedition tools
• Understanding of SI/PI tools and package model extraction
• Knowledge of substrate manufacturing processes and high-speed interfaces
• Scripting experience (PERL, Python, TCL)

This is an excellent opportunity for an experienced engineer to make significant contributions to Apple's hardware innovation while working with cutting-edge technology and world-class teams.