IC Packaging Engineer

We are looking for a senior level electronic packaging engineer to work on developing exciting products. The role involves providing module packaging solutions for various consumer markets, working with internal teams and external suppliers to develop and deploy new packaging technologies. Key responsibilities include:

• Defining new optical and MEMS module/package characteristics based on system-level performance, cost, and footprint requirements.
• Conducting initial package layout and architecture scoping.
• Working with cross-functional teams on FMEA, DFM, FEA, and POC builds.
• Conducting materials characterization and defining process control items and specs.
• Assessing manufacturing readiness, performing yield analysis, and problem-solving.
• Defining packaging roadmaps and managing supplier pathfinding activities.

The ideal candidate should have strong cross-functional influence, leadership skills, and a proven track record in high-volume manufacturing environments. This role offers an opportunity to work on innovative products at a leading technology company, with competitive compensation and benefits.