IC Package Process Engineer, Dojo

Tesla is a leading electric vehicle and clean energy company, known for innovation in AI, robotics, and sustainable technology.
$120,000 - $264,000
Embedded
Mid-Level Software Engineer
In-Person
5,000+ Employees
2+ years of experience
AI · Automotive

Description For IC Package Process Engineer, Dojo

Tesla's Dojo & Self-Driving Hardware team is seeking an IC Package Process Engineer to lead assembly processes for advanced IC packages. This role involves pathfinding, development, and high-volume manufacturing design for next-generation Self-Driving Hardware and Dojo Super AI Computer. The engineer will work closely with EE, SI/PI, thermal/mechanical, and package design teams, interfacing with various vendors. Key responsibilities include:

  • Leading SoC packaging assembly process integration at Tesla
  • Exploring and driving industry-advanced semiconductor packaging technology development
  • Collaborating with OSATs vendors to bring advanced packaging solutions from concept to high-volume manufacturing

The ideal candidate will have:

  • Bachelor's Degree in a relevant field or equivalent experience
  • 2+ years of experience in semiconductor packaging technology, design, and manufacturing processes
  • Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
  • Solid experience in advanced packaging assembly processes and failure analysis
  • Excellent engineering problem-solving skills with strong physics fundamentals
  • Outstanding communication skills for cross-functional and supplier collaboration

This role offers a competitive salary range of $120,000 - $264,000 annually, plus cash and stock awards, and comprehensive benefits. Tesla provides an inclusive work environment and is committed to diversity and reasonable accommodations for individuals with disabilities.

Last updated 2 hours ago

Responsibilities For IC Package Process Engineer, Dojo

  • Work with cross-functional groups at Tesla and lead SoC packaging assembly process integration
  • Explore and drive industry on advance semiconductor packaging technology development for new leading-edge products
  • Work with OSATs vendors to bring advanced packaging solutions from concept to high volume manufacturing

Requirements For IC Package Process Engineer, Dojo

  • Bachelor's Degree in a relevant field, or equivalent experience
  • 2+ years experience in semiconductor packaging technology, design and manufacturing process
  • Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
  • Solid experience in advanced packaging assembly processes and failure analysis
  • Excellent engineering problem solving skills with strong physics and fundamentals
  • Excellent communication skills

Benefits For IC Package Process Engineer, Dojo

Medical Insurance
Dental Insurance
Vision Insurance
401k
Equity
Parental Leave
Commuter Benefits
  • Medical Insurance
  • Dental Insurance
  • Vision Insurance
  • 401k
  • Employee Stock Purchase Plans
  • Life Insurance
  • AD&D Insurance
  • Short-term Disability
  • Long-term Disability
  • Employee Assistance Program
  • Paid Time Off
  • Paid Holidays
  • Back-up Childcare
  • Parenting Support Resources
  • Critical Illness Insurance
  • Hospital Indemnity
  • Accident Insurance
  • Legal Services
  • Pet Insurance
  • Weight Loss Program
  • Tobacco Cessation Program
  • Tesla Babies Program
  • Commuter Benefits
  • Employee Discounts

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