Staff IC Packaging Mechanical Engineer, Dojo
Description For Staff IC Packaging Mechanical Engineer, Dojo
Tesla's Dojo & Self-Driving Hardware team is seeking a Staff IC Package Mechanical Engineer to drive the development of advanced IC packaging for their next-generation Self-Driving Hardware and Dojo Super AI Computer. This is a highly visible role where you'll work at the intersection of hardware innovation and artificial intelligence.
The position offers an exciting opportunity to work on cutting-edge technology that directly impacts Tesla's autonomous driving capabilities and AI computing infrastructure. You'll be responsible for mechanical simulation, materials characterization, and ensuring the reliability of advanced IC packaging solutions. Working closely with cross-functional teams, you'll influence packaging architecture decisions and drive design improvements for manufacturing and reliability.
The role requires a strong background in IC packaging mechanical/material engineering, with expertise in finite element analysis tools and advanced packaging technologies. You'll apply your knowledge to solve complex engineering challenges, from component warpage analysis to optimization of structural designs. The position offers exposure to state-of-the-art packaging technologies, including 2.5D/3D packages, SoC & HBM integration, and 3D IC structural concepts.
Tesla offers a comprehensive benefits package, including competitive salary with stock awards, excellent healthcare coverage, 401(k) with employer match, and various family-friendly benefits. The company's culture promotes innovation, problem-solving, and personal growth in a fast-paced environment. Located in the San Francisco Bay Area, you'll be working at the heart of Silicon Valley's technology ecosystem.
This role is perfect for someone who thrives in a dynamic environment, has a passion for advancing technology, and wants to contribute to Tesla's mission of accelerating the world's transition to sustainable energy. The position offers both technical challenges and leadership opportunities, making it an excellent choice for experienced engineers looking to make a significant impact in the automotive and AI industries.
Responsibilities For Staff IC Packaging Mechanical Engineer, Dojo
- Perform numerical mechanical simulation of advanced IC packages
- Conduct first-principles analysis for component warpage and stress-strain
- Model and simulate manufacturing and assembly process
- Conduct packaging thermal and mold flow analysis
- Perform packaging materials characterization
- Interface with material, substrate, memory, foundry and assembly house vendors
Requirements For Staff IC Packaging Mechanical Engineer, Dojo
- Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering
- Strong hands-on experience of major FEM tools (ANSYS, ABAQUS)
- Deep understanding of packaging materials, mechanical characterization and qualification methodology
- Knowledge of advanced packaging technology
- Excellent engineering problem solving skills
- Programming experience using Matlab, Python and fundamental machine learning capability (preferred)
Benefits For Staff IC Packaging Mechanical Engineer, Dojo
- Medical insurance with $0 payroll deduction options
- Family-building, fertility, adoption and surrogacy benefits
- Dental and vision plans
- Health Savings Account (HSA) with company contribution
- Healthcare and Dependent Care FSA
- 401(k) with employer match
- Employee Stock Purchase Plans
- Life, AD&D, short-term and long-term disability insurance
- Employee Assistance Program
- Sick and Vacation time
- Back-up childcare
- Commuter benefits
- Employee discounts
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