Very good pay and benefits.
A very harsh environment to work in.
The interview had three rounds. The first round was with a "bar raiser" who mainly asked "LP" questions. The second round was with a manager who discussed product and asked both "LP" and technical questions. Finally, an SDEII interviewed me. I fa
Very easy. I had two rounds of interviews: * One online assessment (OA) * One pair coding question The OA questions were slightly harder, whereas the pair coding was a very easy coding problem.
The interview process involved three rounds: * A initial phone interview. * Concluding with a two-day panel round. The panel round heavily emphasized system design, Linux kernel development, and Amazon principles. It was a quick and pleasant p
The interview had three rounds. The first round was with a "bar raiser" who mainly asked "LP" questions. The second round was with a manager who discussed product and asked both "LP" and technical questions. Finally, an SDEII interviewed me. I fa
Very easy. I had two rounds of interviews: * One online assessment (OA) * One pair coding question The OA questions were slightly harder, whereas the pair coding was a very easy coding problem.
The interview process involved three rounds: * A initial phone interview. * Concluding with a two-day panel round. The panel round heavily emphasized system design, Linux kernel development, and Amazon principles. It was a quick and pleasant p