Amazon

The interview process was tough. There were back-to-back technical rounds. One was a Bar Raiser round, and two were LeetCode rounds. Two medium-level questions were asked in each round, along with discussions on LP principles.

Three rounds in total. - First behavioral - Second technical DSA coding - Third Low Level Design Interviewers were friendly, and questions were easy to crack. I would say preparing Amazon LPA is the best and sure-shot way to crack the interview.

It's a four-round interview, with every round being technical. The first three rounds focus on DS and Algo, and the last round is OOD. For OOD, they asked for an elevator simulation. For the third round, they asked about merging intervals. Most of th