Analog Devices

3 rounds of technical 1 round of HR Waste of attending interview at these companies. No proper process and moto except hire low budget. Interview was for core BSP developer for new platform company was developing. Technical panel was concentrated o

Campus placements are conducted in 4 stages. The process includes a technical exam followed by two sessions of a 3-member panel of interview and then at last an HR round. Technical rounds focus on your basic knowledge, where they check if your funda

A telephonic interview where they will just try to understand your background, skills and past projects. Three rounds of F2F interview. Average technical questions, not very tough. Try to check basic concepts about embedded systems and device drive