atmosphere, salary, food, solid work, location
Very big company, not always interesting.
Interview Process: * Screening round with hiring manager * Technical round (~45 minutes) * Onsite round (7-8 rounds, 1 hour each, in a single day) Questions will cover DSP, ML, and 3D Geometry.
The recruiter contacted me two weeks after I applied. I had one technical phone interview. Then, I completed one take-home exam. Following that, I had an onsite interview which consisted of seven back-to-back interviews. I received an offer one w
I went to the interview and they asked me 3 questions. * 2 about hardware * 1 about algo and databases It was all in one day. The order of the questions was shuffled.
Interview Process: * Screening round with hiring manager * Technical round (~45 minutes) * Onsite round (7-8 rounds, 1 hour each, in a single day) Questions will cover DSP, ML, and 3D Geometry.
The recruiter contacted me two weeks after I applied. I had one technical phone interview. Then, I completed one take-home exam. Following that, I had an onsite interview which consisted of seven back-to-back interviews. I received an offer one w
I went to the interview and they asked me 3 questions. * 2 about hardware * 1 about algo and databases It was all in one day. The order of the questions was shuffled.