The internship was well designed, and I was placed in a very friendly and supportive team.
I don't really have any cons. It would be better if my internship was in person.
Interview Process: * Screening round with hiring manager * Technical round (~45 minutes) * Onsite round (7-8 rounds, 1 hour each, in a single day) Questions will cover DSP, ML, and 3D Geometry.
Received interview request from recruiter for scheduling interview. Interview through Webex. It was a smooth process through email. Most of the interview were conducted online.
The process took a couple of weeks, but this was due to being contacted right before the December holidays. First, I had a 30-minute call with the recruiter. Then, a 45-minute technical interview with the hiring manager. Everything was fast, and t
Interview Process: * Screening round with hiring manager * Technical round (~45 minutes) * Onsite round (7-8 rounds, 1 hour each, in a single day) Questions will cover DSP, ML, and 3D Geometry.
Received interview request from recruiter for scheduling interview. Interview through Webex. It was a smooth process through email. Most of the interview were conducted online.
The process took a couple of weeks, but this was due to being contacted right before the December holidays. First, I had a 30-minute call with the recruiter. Then, a 45-minute technical interview with the hiring manager. Everything was fast, and t