Applied Materials

Complete details on Wafer Fabrication process. There were 3 technical rounds followed by an HR round. The interview process is quick; each round goes for 2 hours, but they are specific to time. The interview starts on time.

Was contacted by HR. A 15-minute interview was scheduled for the following day. The requirement was for a legacy project. The interviewer right away asked me to turn my camera on without having the courtesy of doing the same himself. He asked me t

I applied via LinkedIn. After a month, HR called me and scheduled a telephonic discussion. It was a screening interview, and then HR scheduled a video interview. In the video interview, I was asked to write any 4 programs out of 5. One design questi