Applied Materials

Complete details on Wafer Fabrication process. There were 3 technical rounds followed by an HR round. The interview process is quick; each round goes for 2 hours, but they are specific to time. The interview starts on time.

Technical interview with a team leader and an experienced software engineer from her team. Another interview with the group manager. HR interview. I applied through a recruiter. All people during the process were extremely nice.

Was contacted by HR. A 15-minute interview was scheduled for the following day. The requirement was for a legacy project. The interviewer right away asked me to turn my camera on without having the courtesy of doing the same himself. He asked me t