Best Place to Work
Best Place to Work
- Open culture.
- Employee-friendly; the company takes care of its employees.
- The office environment is very good.
- IT support is fast.
- Stock advantages for FTE.
- The hierarchy is straightforward.
- You will get good chances to learn more and more.
- Work-life balance.
Overall, it's good to work with Applied.
I don't see any downside in this company.
Additional Ratings
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Applied Materials Interview Experiences
Software Engineer Intern
Had 3 rounds: 1. Assessment (technical+aptitude) Had questions on code snippets (C++), questions on OOPs, OS, and DSA, and aptitude. 2. Written DSA round Easy to medium level LeetCode questions, but no STL was allowed. 3. Technical round (OOPs+OS+
Nodejs Developer
First round: technical. Second round: in-person. They asked me to write sorting algorithms and about the event loop and async functions. Questions included which console log would print first, and I was asked to draw some diagrams on the board.
New Product Manufacturing Engineer
Two rounds of technical interviews, and then HR. Both rounds focused on technical aspects of my domain and my project. HR was pretty much normal and up to the mark.
Software Engineer Intern
Bengaluru, Karnataka, IndiaSeptember 1, 2025Had 3 rounds: 1. Assessment (technical+aptitude) Had questions on code snippets (C++), questions on OOPs, OS, and DSA, and aptitude. 2. Written DSA round Easy to medium level LeetCode questions, but no STL was allowed. 3. Technical round (OOPs+OS+
Nodejs Developer
Bengaluru, Karnataka, IndiaJuly 28, 2025First round: technical. Second round: in-person. They asked me to write sorting algorithms and about the event loop and async functions. Questions included which console log would print first, and I was asked to draw some diagrams on the board.
New Product Manufacturing Engineer
Bengaluru, Karnataka, IndiaJuly 15, 2025Two rounds of technical interviews, and then HR. Both rounds focused on technical aspects of my domain and my project. HR was pretty much normal and up to the mark.
