Bloomberg LP

I first applied through the campus career fair. I then got a technical interview scheduled for a Saturday. Upon finishing that interview, I was immediately scheduled for another round of technical interview the next day. After a week or so, I recei

The interview process involved no online assessment, one round for a phone interview, and two rounds for the virtual onsite part. All the interviewers were very friendly and willing to help me. However, based on past experience, to secure an offer,

I applied on campus and was called for an interview within a week. I had a cursory first round where I was asked to implement string copy, considering various corner cases. The second round involved printing a 2D matrix in a spiral. I didn't fully an