A good company to work for and gain experience.
Not fit at bond and too long.
Good
Campus placement (three rounds). All three rounds were conducted in one day, and the whole selection process was completed within the same day. Below are the three rounds: 1. Written exam (logical, verbal, and analytical skills). 2. Group discussi
One basic aptitude test to assess intelligence and reflex levels. One face-to-face technical round where your previous project experience and basic technical skills will be tested. Then, an HR round to receive an offer letter.
On-campus interview. Placed in September 2016, but until now, December 2017, I haven't received the call letter. Written, TR, and HR rounds were part of the process. All were easy to crack.
Campus placement (three rounds). All three rounds were conducted in one day, and the whole selection process was completed within the same day. Below are the three rounds: 1. Written exam (logical, verbal, and analytical skills). 2. Group discussi
One basic aptitude test to assess intelligence and reflex levels. One face-to-face technical round where your previous project experience and basic technical skills will be tested. Then, an HR round to receive an offer letter.
On-campus interview. Placed in September 2016, but until now, December 2017, I haven't received the call letter. Written, TR, and HR rounds were part of the process. All were easy to crack.