Complete lack of structure for interns
Complete lack of structure for interns
Would give 0 stars if I could.
My manager (my only primary point of contact) never fully prepared a project for me to work on, despite consistent follow-ups. I felt like I learned very little from the experience because of the lack of structure.
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Goldman Sachs Interview Questions
Goldman Sachs Interview Experiences
Software Engineering Intern
4 rounds. Superday technicals are largely up to the interviewer, and the questions asked can range from algorithms to resume-based questions. * Timed Leetcode assignment * Hirevus * Superday Technicals * Superday Behaviourals
Software Engineering Intern
They sent me an automatic OA, which I completed with 100%. A few months later, there was a reach-out from a recruiter about a "superday". During the "superday", there were multiple rounds of interviews, including behavioral and technical.
Software Engineering Intern
There were two technical rounds. The first was a basic OOPS and resume review. The second was also a technical round involving DSA and DP questions. Some students had three rounds, while some were hired in the second round.
Software Engineering Intern
Singapore, SingaporeApril 7, 20254 rounds. Superday technicals are largely up to the interviewer, and the questions asked can range from algorithms to resume-based questions. * Timed Leetcode assignment * Hirevus * Superday Technicals * Superday Behaviourals
Software Engineering Intern
United StatesNovember 14, 2024They sent me an automatic OA, which I completed with 100%. A few months later, there was a reach-out from a recruiter about a "superday". During the "superday", there were multiple rounds of interviews, including behavioral and technical.
Software Engineering Intern
Bangalore Rural, Karnataka, IndiaAugust 1, 2023There were two technical rounds. The first was a basic OOPS and resume review. The second was also a technical round involving DSA and DP questions. Some students had three rounds, while some were hired in the second round.
