Taro Logo

Firmware Engineer Interview Experience

October 1, 2025
Positive ExperienceNo Offer

Process

Four rounds of interview:

  • Pre-screening with recruiter over the phone.
  • Technical interview with two engineers.
  • Interview with one hiring manager not part of the team currently interviewing for.
  • Interview with the hiring manager that is part of the team you will be working for.

Questions

A lot of questions about hardware.

Was this helpful?

Interview Statistics

The following metrics were computed from 3 interview experiences for the Hewlett Packard Enterprise Firmware Engineer role.

Success Rate

33%
Pass Rate

Hewlett Packard Enterprise's interview process for their Firmware Engineer roles is fairly selective, failing a large portion of engineers who go through it.

Experience Rating

Positive100%
Neutral0%
Negative0%

Candidates reported having very good feelings for Hewlett Packard Enterprise's Firmware Engineer interview process.