Intel

The telephonic interview covered projects and basic questions. The 1:1 interview was a deep dive into projects and expertise. The face-to-face interview had 5 rounds and lasted the entire day. Questions focused on video decoder and encoder concepts

I applied through campus recruitment. It was a two-round process. First round: Resume shortlist. Second round: Technical interview. Basic questions on analog and digital electronics were asked. Basics related to VHDL and VLSI were also asked.

I attended a tech talk by the company at our career fair. A brief overview of the company was presented, followed by a more in-depth look at the presenter's group and its relationship to products. A phone interview took place afterward, and then a d