There are 3 rounds:

• First, a round with the Hiring Manager.
• Followed by 2 Technical rounds conducted by the team members.
• If you pass these, there will be a follow-up HR round.

• Basics of memory devices (e.g., DRAM, NAND, etc.)
• SA circuit debugging
• Questions related to your previous work experience
• Fundamentals of semiconductor fabrication
• Basic coding questions