Compensation is good. Management sucks.
Workload is high. Growth not so good.
I joined through a campus interview. They followed the below process during our placement: 1. Written test - This included sections like reasoning, logical ability, and technical questions related to EC. 2. Technical round (1 or 2) - For me, it was
The interview process involved five rounds of face-to-face interviews and one phone interview. I applied online and attended interviews on campus, which lasted for a full day. The next day, I had a phone interview from headquarters. It took one wee
I was interviewing for Qualcomm on behalf of Collabera. The interview scheduling was good and happened on time. Although it was rescheduled, the panel had to attend an emergency meeting.
I joined through a campus interview. They followed the below process during our placement: 1. Written test - This included sections like reasoning, logical ability, and technical questions related to EC. 2. Technical round (1 or 2) - For me, it was
The interview process involved five rounds of face-to-face interviews and one phone interview. I applied online and attended interviews on campus, which lasted for a full day. The next day, I had a phone interview from headquarters. It took one wee
I was interviewing for Qualcomm on behalf of Collabera. The interview scheduling was good and happened on time. Although it was rescheduled, the panel had to attend an emergency meeting.