Opportunity to work on cutting-edge technologies.
Dynamic environment; sometimes it gets tough to cope up.
The hiring process was normal, as with any company. It involved a telephonic interview and then a face-to-face interview with three people. They shortlisted my resume from their website and then scheduled the telephonic interview. Two weeks later, t
First Screening Round: 1. Online Test (HackerRank) 2. Technical 1 (two-person panel) 3. Technical 1:1 (one-person panel) 4. Manager round 5. HR round An offer follows if you clear all rounds.
The interview was scheduled for a day, with 3-4 rounds of technical discussion involving many VLSI topics. These topics included UPF, RTL, synthesis, and LEC. It started with basic concepts and proceeded to advanced questions.
The hiring process was normal, as with any company. It involved a telephonic interview and then a face-to-face interview with three people. They shortlisted my resume from their website and then scheduled the telephonic interview. Two weeks later, t
First Screening Round: 1. Online Test (HackerRank) 2. Technical 1 (two-person panel) 3. Technical 1:1 (one-person panel) 4. Manager round 5. HR round An offer follows if you clear all rounds.
The interview was scheduled for a day, with 3-4 rounds of technical discussion involving many VLSI topics. These topics included UPF, RTL, synthesis, and LEC. It started with basic concepts and proceeded to advanced questions.