Qualcomm

The hiring process was normal, as with any company. It involved a telephonic interview and then a face-to-face interview with three people. They shortlisted my resume from their website and then scheduled the telephonic interview. Two weeks later, t

The interview process consisted of both telephonic and face-to-face interviews. In total, there were 3-4 rounds. Each round tested technical skills for the role. Positives: * Extremely quick feedback after each round. Negatives: * Interviews did

The interview was scheduled for a day, with 3-4 rounds of technical discussion involving many VLSI topics. These topics included UPF, RTL, synthesis, and LEC. It started with basic concepts and proceeded to advanced questions.