A lot of learnings while working on low power tech nodes.
Too many deliveries, and the deadlines.
The interview process involved a telephonic screening, followed by 5 rounds with the India team and 2 rounds with the US team. Questions ranged from protocol questions, C++ problem-solving, embedded systems questions, and puzzles.
The interview process consists of 2 rounds. Most questions are from synthesis, CLP, LEC, and STA. Questions include: * What issues were faced during synthesis? * What issues were faced during LEC? * What issues were faced in STA?
The process included 4 technical rounds and 1 HR round. All technical rounds were long and comprehensive. They asked about everything written in my resume, including every IP I worked on with detailed block diagrams and explanations.
The interview process involved a telephonic screening, followed by 5 rounds with the India team and 2 rounds with the US team. Questions ranged from protocol questions, C++ problem-solving, embedded systems questions, and puzzles.
The interview process consists of 2 rounds. Most questions are from synthesis, CLP, LEC, and STA. Questions include: * What issues were faced during synthesis? * What issues were faced during LEC? * What issues were faced in STA?
The process included 4 technical rounds and 1 HR round. All technical rounds were long and comprehensive. They asked about everything written in my resume, including every IP I worked on with detailed block diagrams and explanations.