Qualcomm

Had three rounds of interviews back to back, followed by a hiring manager interview. Mostly covered CPU architecture and programming skills. Topics included CPU instruction sets and interrupts (types of interrupts, etc.). Programming was in C, and

5 technical rounds + 1 HR round Technical rounds were mostly on subject matter depth and understanding, with a few simple coding tests to check DS/Algo basics. Subject matter depth was tested thoroughly with different scenarios and corner cases.

A total of 5 rounds were scheduled within approximately a week. Another 2 weeks were allocated for offer release. After the completion of all interview rounds, I received a call from HR regarding my selection. The final offer release took 2 weeks.