Change fast, world's best product.
No flexibility in working. No work initiative.
The interview was for an internship through college placements. Questions covered basic physical design and CMOS-related topics. There were also many digital logic questions, and a puzzle was included. The interview consisted of two technical round
At first, I got a screening email from HR to provide more details about myself. After that, I got a screening call from HR, followed by a second screening call from the Team Lead. Then, I had an on-site interview with the Team Lead.
The interview process was good. Smooth interview process. It takes 1-3 weeks. First round was screening. It talks about your legal status, experience, and salary expectations. Second round is technical. It went for about 1.5 hours. Third round was
The interview was for an internship through college placements. Questions covered basic physical design and CMOS-related topics. There were also many digital logic questions, and a puzzle was included. The interview consisted of two technical round
At first, I got a screening email from HR to provide more details about myself. After that, I got a screening call from HR, followed by a second screening call from the Team Lead. Then, I had an on-site interview with the Team Lead.
The interview process was good. Smooth interview process. It takes 1-3 weeks. First round was screening. It talks about your legal status, experience, and salary expectations. Second round is technical. It went for about 1.5 hours. Third round was