1. HR Google Meet call: no email to ask my availability. They just sent an invitation with the time and link, with no prior notification.
2. Technical video interview with the hiring manager.
3. ME written test: very thorough.
4. Second round technical video interview with a team member.
5. I was told the team moved forward with other candidates for an onsite.

Phone interview:

• Showed me a plastic housing picture, asked a few questions about injection molding:

  • Which features will you improve?
  • Where is the core/cavity?
  • In which direction will the plastic be injected?
  • How to make side holes in an injection mold?

• If you need to design an electrical package that needs to be mounted underneath a vehicle, which requirements will you ask for? Which tests will you recommend? How would you perform those tests?

Written test (open book):

Covers ME and EE questions, beam, beam stiffness, injection molding, buckling loads, vibration, thermal expansion, FBD, ME drawings, fluid mechanics, manufacturing methods, thermal conduction, RLC circuit, mechanical bonding calculation...

2nd phone interview:

• Asked about the hardest project I did and dug into it.
• How to deal with a vendor who made bad parts.