Learned a lot about the semiconductor industry.
Product Engineering at TI is a lot for an intern.
One initial contact at a job fair, then one video call like Zoom, but using TI’s system, where your screen is shared and you present a project that you’ve worked on. The last step was an in-person interview in Dallas, where they pay for the flight, t
Went through 12 people and it was very robust and to the point. I went through management personnel, ordinary engineers, and human resources personnel. I enjoyed it because I had looked at the job requirements effectively, and it fit very well with w
University recruitment drive: Job fair: On-campus interview followed by an on-site interview.
One initial contact at a job fair, then one video call like Zoom, but using TI’s system, where your screen is shared and you present a project that you’ve worked on. The last step was an in-person interview in Dallas, where they pay for the flight, t
Went through 12 people and it was very robust and to the point. I went through management personnel, ordinary engineers, and human resources personnel. I enjoyed it because I had looked at the job requirements effectively, and it fit very well with w
University recruitment drive: Job fair: On-campus interview followed by an on-site interview.