IC Packaging Engineer – WLP
Description For IC Packaging Engineer – WLP
Apple is seeking an IC Packaging Engineer to join their Hardware team in Santa Clara. This role focuses on groundbreaking technology and product development, specifically in IC packaging engineering. The position involves leading packaging technology development, including advanced 2.5D/3D packaging, and working with multi-functional teams on SoC Package integration. The ideal candidate will have 3+ years of experience in semiconductor packaging, with strong knowledge of materials characterization and packaging technologies. This role offers comprehensive benefits including medical coverage, stock options, and educational support. The position combines technical expertise with innovation, requiring someone who can drive sophisticated package solutions from concept to high-volume manufacturing. The role offers competitive compensation ranging from $143,100 to $264,200, with additional benefits and growth opportunities within Apple's dynamic environment.
Responsibilities For IC Packaging Engineer – WLP
- Lead packaging technology development including advanced 2.5D/3D packaging
- Work with multi-functional team and lead SoC Package integration efforts
- Package Architecture / Package Integration Innovation
- Work with foundry and OSAT to bring packaging solution from concept to HVM
- Drive industry with sophisticated Package solutions, new material development, and specs
- 5% International travel
Requirements For IC Packaging Engineer – WLP
- BS and 3+ years of relevant industry experience
- Experience working in the Semiconductor Packaging field
- Knowledge of materials characterization and analysis
- Understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology
- Understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques
- Capabilities using package design softwares, APD, Virtuoso
- Knowledge of the latest developments in memory packaging
- Good program management skills
Benefits For IC Packaging Engineer – WLP
- Comprehensive medical and dental coverage
- Retirement benefits
- Employee stock programs
- Discounted products and free services
- Education reimbursement
- Discretionary bonuses
- Commission payments
- Relocation benefits
