Google's Devices and Services team is seeking a Packaging Engineer for their Custom Silicon Operation. This role combines Google AI, Software, and Hardware to create innovative experiences for users. The ideal candidate will have expertise in semiconductor packaging technologies, assembly processes, and failure analysis techniques. They will lead cross-functional teams, drive technical issues from New Product Introduction to mass production, and be responsible for yield monitoring, improvement, and excursion management.
Key Responsibilities: • Define custom silicon package processes • Monitor and improve yield • Manage excursions and conduct failure analysis • Drive resolution of technical and operational issues • Lead early production site qualifications for New Product Introduction • Conduct root cause analysis for excursions • Establish and validate process capability and performance metrics with suppliers
The role requires a balance of technical expertise and project management skills, with a focus on creating products that are accessible and useful for all users. Google emphasizes diversity, equity, and inclusion in its work environment and aims to build a workforce representative of its global user base.
This position offers an opportunity to work on cutting-edge technology in the field of custom silicon and contribute to Google's mission of organizing the world's information and making it universally accessible and useful.