Packaging Engineer, Custom Silicon Operation

Google is a global technology company that specializes in internet-related services and products, including search, cloud computing, software, and hardware.
New Taipei, Banqiao District, New Taipei City, Taiwan
Backend
Mid-Level Software Engineer
In-Person
5,000+ Employees
5+ years of experience
AI · Consumer
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Description For Packaging Engineer, Custom Silicon Operation

Google's Devices and Services team is seeking a Packaging Engineer for their Custom Silicon Operation. This role combines Google AI, Software, and Hardware to create innovative experiences for users. The ideal candidate will have expertise in semiconductor packaging technologies, assembly processes, and failure analysis techniques. They will lead cross-functional teams, drive technical issues from New Product Introduction to mass production, and be responsible for yield monitoring, improvement, and excursion management.

Key Responsibilities: • Define custom silicon package processes • Monitor and improve yield • Manage excursions and conduct failure analysis • Drive resolution of technical and operational issues • Lead early production site qualifications for New Product Introduction • Conduct root cause analysis for excursions • Establish and validate process capability and performance metrics with suppliers

The role requires a balance of technical expertise and project management skills, with a focus on creating products that are accessible and useful for all users. Google emphasizes diversity, equity, and inclusion in its work environment and aims to build a workforce representative of its global user base.

This position offers an opportunity to work on cutting-edge technology in the field of custom silicon and contribute to Google's mission of organizing the world's information and making it universally accessible and useful.

Last updated 7 months ago

Responsibilities For Packaging Engineer, Custom Silicon Operation

  • Follow responsibilities in the area of custom silicon package process definition, yield monitoring and yield improvement, excursion management and failure analysis
  • Drive and resolve technical and operational issues of material, process, fixtures and equipment to enable delivery of product and manufacturing process from New Product Introduction (NPI) to mass production
  • Lead early production site qualifications for NPI, Lead Yield and process improvements
  • Lead Excursion root cause analysis. Lead suppliers to establish and validate process capability and performance metrics (using statistical tools and techniques) for consistently delivering quality products and for excursion management

Requirements For Packaging Engineer, Custom Silicon Operation

  • Bachelor's degree in a technical field, or equivalent practical experience
  • 5 years of experience in program management
  • 5 years of experience as a Semiconductor Packaging Engineer
  • Experience in packaging technologies, assembly processes, Integrated Circuit (IC) packaging materials, reliability standards, Failure Analysis (FA) techniques
  • Experience in leading cross-functional teams
  • Ability to travel as required

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