Interim Engineering Intern_2026_HW
Description For Interim Engineering Intern_2026_HW
Qualcomm, a global leader in mobile technology and 5G innovation, is seeking an Engineering Intern for their Hardware team. This prestigious internship opportunity offers exposure to cutting-edge technology in areas including SOC design, RF/Analog layout, FPGA design, and CPU architecture. The role is perfect for students pursuing Masters or Bachelors in Electrical Engineering, VLSI, or ECE who are passionate about hardware engineering and semiconductor technology.
The position offers hands-on experience in various aspects of hardware design and validation, including SOC & Hard Macro Physical Design, RF & Analog Layout, Digital ASIC Design, and CPU Design. Interns will work alongside industry experts and contribute to real-world projects that shape the future of mobile technology and connectivity.
Qualcomm provides a comprehensive learning environment with access to continuous development programs, mentorship opportunities, and tuition reimbursement. The company's culture promotes innovation, collaboration, and professional growth, making it an ideal place for aspiring engineers to launch their careers.
The role requires strong technical fundamentals in hardware design, including knowledge of Verilog/VHDL, C/C++, and various hardware components like PLL, CMOS, and ADC/DAC. Successful candidates will combine technical expertise with strong analytical, problem-solving, and communication skills.
Working at Qualcomm means being part of a team that's driving technological breakthroughs in 5G, AI, and mobile computing. The company offers comprehensive benefits including world-class health coverage, financial planning support, and wellbeing programs. This internship is an exceptional opportunity to contribute to world-changing innovations while developing professional expertise in hardware engineering.
Responsibilities For Interim Engineering Intern_2026_HW
- SOC & Hard Macro Physical Design
- SOC Validation & Debug
- RF & Analog Layout
- RF/Analog/Mixed Signal/Power IC Design
- Low Power Design
- Board and FPGA Design
- Digital ASIC Design
- Design/SOC Verification
- CAD Solution Engineering
- Design for Test (DFT)
- CPU Design
Requirements For Interim Engineering Intern_2026_HW
- Educational Background: Masters or Bachelors in Electrical Engineering, VLSI, Embedded and VLSI, ECE
- Knowledge of Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting
- Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout
- Excellent analytical and problem solving skills
- Good verbal and written communication skills
- Ability to collaborate and work in teams
Benefits For Interim Engineering Intern_2026_HW
- World-class health coverage for employees and eligible dependents
- Financial programs to build secure future
- Emotional/mental strength and resilience support
- Wellbeing programs
- Continuous learning and development programs
- Tuition reimbursement
- Mentorship programs
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