Staff EDA Engineer, Packaging

Qualcomm is seeking a Staff EDA Engineer to join their Data Center team, focusing on developing high-performance, energy-efficient server solutions. This role sits at the intersection of hardware design and software development, specifically in the advanced packaging space with emphasis on 2.5D/3D IC package design and analysis.

The position offers an opportunity to work with cutting-edge technology and influence industry standards through collaboration with EDA vendors, SOC Foundries, and packaging SAT houses. The successful candidate will be responsible for developing and qualifying EDA reference flows, creating automation tools, and working closely with internal teams to optimize package and system design processes.

The role requires a strong technical foundation with a Bachelor's degree in Engineering or Computer Science, though an MS with 2+ years of relevant experience is preferred. Key technical skills include experience with various EDA tools like Cadence APD/SIP, Innovus, and Virtuoso, as well as programming proficiency in languages such as Python, Java, and Tcl/Tk.

Qualcomm offers a competitive compensation package including a base salary range of $154,000 to $231,000, plus annual bonuses and RSU grants. The company provides comprehensive benefits including health coverage, 401k, and various work-life balance programs. This position is based in San Diego, California, offering the opportunity to work with one of the world's leading technology companies in a collaborative, innovation-driven environment.

The role combines technical expertise with leadership opportunities, requiring strong communication skills and the ability to guide teams and influence industry direction. It's an ideal position for someone looking to make a significant impact in the semiconductor industry while working with advanced packaging technologies and automated design tools.