Amazon

Three-round loop interview. 1st round: LLD regarding designing a package installer with dependencies. 2nd round: Heap-related question. 3rd round: Another untagged question involving subnet masks. It had nothing to do with subnet masks; it was done

The interview consisted of 3 rounds. Round 1 had 3 LeetCode Medium problems. Round 2 had a Low-Level Design question and 2 Live Programming questions, each with 1 follow-up. Round 3 was purely Live Programming with multiple follow-ups.

I applied in late September. I received the OA on October 11 and completed it within a week. The OA had three parts: * Coding assessment: This consisted of two LeetCode questions, one easy and one medium. I scored 15/15 on the easy and 11/15 on