To lean IC manufacturing tools
Poor work-life balance in this company.
My interview process was fully conducted via telephonic rounds only.
Two panels of technical round questions are in global demand in SAP BTP. If you are working in the latest technologies like cloud integration, it would be very helpful. I have got selected but declined due to personal reasons.
1. Online coding. 2. F2F over Zoom (don't remember exactly) with a coding pad. 3. HR negotiations. Overall, it took one month to release the offer after the HR negotiation round, with a lot of follow-ups. Initially, I declined because of the package
My interview process was fully conducted via telephonic rounds only.
Two panels of technical round questions are in global demand in SAP BTP. If you are working in the latest technologies like cloud integration, it would be very helpful. I have got selected but declined due to personal reasons.
1. Online coding. 2. F2F over Zoom (don't remember exactly) with a coding pad. 3. HR negotiations. Overall, it took one month to release the offer after the HR negotiation round, with a lot of follow-ups. Initially, I declined because of the package