Good and OK
Good and OK
Fine company to work in. Work from home option.
Promotions take longer.
Experience is given more importance than talent or skills.
Behave like a product company and stop chasing price cuts everywhere.
Be more innovative and create a challenging environment to get the best out of each employee.
Dissolve the laid-back attitude and remove non-performing managers/senior managers.
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Fidelity Investments Interview Questions
Fidelity Investments Interview Experiences
Lead Software Engineer
Totally, I had 4 rounds on the same day. It was a really very good experience. I was told that I got selected and received a call from HR on the next day. I received my offer letter after 3 weeks.
Lead Software Engineer
Location: Bangalore Type: Internal (IJP) Talked about the projects in detail. A few questions were thrown in. Talked about the tech used in the projects and a few more questions, like why you used certain technologies.
Lead Software Engineer
Total 4 rounds: 1. System programming. 3 programs, 1.5 hrs. 2. Tech 1. 15-30 mins. Scenario-based questions asked me different approaches to solve it. 3. Tech 2. 15 mins. Starts with basic OOPs, then some design patterns related questions. 4. HR
Lead Software Engineer
Chennai, Tamil Nadu, IndiaDecember 18, 2019Totally, I had 4 rounds on the same day. It was a really very good experience. I was told that I got selected and received a call from HR on the next day. I received my offer letter after 3 weeks.
Lead Software Engineer
IndiaJuly 6, 2022Location: Bangalore Type: Internal (IJP) Talked about the projects in detail. A few questions were thrown in. Talked about the tech used in the projects and a few more questions, like why you used certain technologies.
Lead Software Engineer
New York, New York, United StatesJanuary 1, 2020Total 4 rounds: 1. System programming. 3 programs, 1.5 hrs. 2. Tech 1. 15-30 mins. Scenario-based questions asked me different approaches to solve it. 3. Tech 2. 15 mins. Starts with basic OOPs, then some design patterns related questions. 4. HR
