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Pacaking Engineer Interview Experience - Phoenix, Arizona

February 1, 2017
Negative ExperienceNo Offer

Process

I applied last December and had a phone screen in January. My interview was scheduled for February, quite soon after.

The interview lasted a whole day and included sessions with HR, the department sponsor, and 6-7 other interviewers. There was a two-hour break for lunch in between.

The questions primarily focused on polymer behavior and related properties in the packaging process. I believe these were asked to assess how one responds to unknown situations.

The overall experience was good, and the people were kind. However, the feedback experience afterward was terrible, as no response came back at all. I suspect many current companies may have this practice of silently rejecting interviewees.

Questions

What can you bring to our group/company?

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Interview Statistics

The following metrics were computed from 1 interview experience for the Intel Pacaking Engineer role in Phoenix, Arizona.

Success Rate

0%
Pass Rate

Intel's interview process for their Pacaking Engineer roles in Phoenix, Arizona is extremely selective, failing the vast majority of engineers.

Experience Rating

Positive0%
Neutral0%
Negative100%

Candidates reported having very negative feelings for Intel's Pacaking Engineer interview process in Phoenix, Arizona.

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