Intel

There will be 3 to 5 rounds of technical interviews and one HR interview if selected. After the HR interview, it may take up to a month to release the offer letter.

Application was submitted via LinkedIn. There were three technical rounds followed by an HR round. All rounds were conducted by individual interviewers, as opposed to panels elsewhere. The interview was mostly a discussion on topics listed on the re

The questions were mostly from embedded systems and also a few LeetCode medium questions. The panel consisted of three interviews, each from a different background. Overall, the interview process was straightforward.