Intel

Application was submitted via LinkedIn. There were three technical rounds followed by an HR round. All rounds were conducted by individual interviewers, as opposed to panels elsewhere. The interview was mostly a discussion on topics listed on the re

The interview process spanned 5 rounds over 3 days. The rounds covered C, Windows internals, driver development, and other logical and C questions, as well as trick questions. Four people conducted the interviews, with each person leading one round.

The questions were mostly from embedded systems and also a few LeetCode medium questions. The panel consisted of three interviews, each from a different background. Overall, the interview process was straightforward.