Technical depth of work (scale, cutting-edge problems) are sometimes less.
Improve recognition. Lack of recognition is becoming constant feedback.
The interview process will be conducted in 6 rounds: 1. Phone/Skype screening for SSE. 2. DS & Algo questions on various topics. 3. Technical round (face-to-face, 1:1). 4. Technical round (face-to-face, 1:3, including project discussion). 5. Manager
The process was general, like first a demo craft, then problem-solving, then managerial. However, the arrangement was horrible. First, the recruiter scheduled an interview, but nobody joined. When I tried to reach out, nobody answered. One week late
1 Telephonic round. 4 face-to-face rounds.
The interview process will be conducted in 6 rounds: 1. Phone/Skype screening for SSE. 2. DS & Algo questions on various topics. 3. Technical round (face-to-face, 1:1). 4. Technical round (face-to-face, 1:3, including project discussion). 5. Manager
The process was general, like first a demo craft, then problem-solving, then managerial. However, the arrangement was horrible. First, the recruiter scheduled an interview, but nobody joined. When I tried to reach out, nobody answered. One week late
1 Telephonic round. 4 face-to-face rounds.