Hardware Engineering (Internship) Interview Experience - United States
Process
I had one phone interview and was then flown out for my final round.
Afterwards, I participated in about 5 hours of straight, in-person interviews.
The questions covered content that I had definitely not learned, so I found them pretty difficult overall.
However, after taking the relevant classes, I realized the questions were still decently difficult and covered the fundamentals of engineering, including:
- Materials
- Fluids
- Thermodynamics
- Manufacturing
Questions
Q: What are the three main types of heat transfer?
Give examples of their usage, either in industry or daily life.
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Interview Statistics
The following metrics were computed from 1 interview experience for the Microsoft Hardware Engineering (Internship) role in United States.
Success Rate
Microsoft's interview process for their Hardware Engineering (Internship) roles in the United States is extremely selective, failing the vast majority of engineers.
Experience Rating
Candidates reported having mixed feelings for Microsoft's Hardware Engineering (Internship) interview process in United States.
Microsoft Work Experiences
- 2.0Microsoft Internship ExperienceHardware Engineering (Internship) • Current EmployeeRedmond, Washington, United StatesMarch 18, 2023Pros: Relaxed work environment and flexible hours.Cons: Little to no impact. You also get assigned to a random team, regardless of your skills.
- 3.0Big Company, Little GrowthSoftware Development Engineer (SDE) • Current EmployeeWest, United StatesJune 11, 2025Pros: Big company, not much work pressure.Cons: not much to learn and grow
- 4.0Good Work, Team MixedSoftware Engineer • Former EmployeeHyderābādMay 23, 2025Pros: Work and team and officesCons: Growth perspective and team culture.
Microsoft Interview Questions
