Qualcomm

The interview process consisted of a total of 5 rounds. The first round was a telephonic interview, followed by four face-to-face rounds. Questions mostly comprised: * Debugging of issues related to memory. * Algorithms and data structures (comple

It was a good experience overall. They asked about various concepts in UVM and SystemVerilog, mainly concentrating on UVM. Topics covered included interfaces, modports, driver-sequencer communication, and more. I was also asked about design concepts

I was interviewed online with two technical rounds, one managerial round, and one HR round. It was a great experience, and HR was very helpful in carrying out a smooth recruitment process.