Qualcomm

The interview process consisted of both telephonic and face-to-face interviews. In total, there were 3-4 rounds. Each round tested technical skills for the role. Positives: * Extremely quick feedback after each round. Negatives: * Interviews did

6 rounds. Details on CPU and GPU architecture. 1-2 Programming questions. Logical quizzes in every round. Past experiences related queries. Interviewers were friendly and helpful. Last round was problem-solving with performance analysis.

They have three technical rounds and one managerial round. It was a good experience. The technical questions were good. It takes about three to four weeks for the complete process. The HR communication was quick.