IC Package Design Engineer

Apple is a technology company that designs, develops, and sells consumer electronics, computer software, and online services.
Hardware
Mid-Level Software Engineer
In-Person
5,000+ Employees
3+ years of experience
Consumer

Description For IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an IC Package Design Engineer to join their innovative group. This role involves inventing, designing, developing, and integrating electronic packaging solutions for Apple's internal and custom external components of hardware for consumer electronic products such as iPhone, iPad, Mac, Apple Watch, and Apple TV.

As an IC Package Design Engineer, you will:

  • Own and drive sophisticated package selection, new generation product package structure, and configuration optimization
  • Be responsible for Package/SIP/module physical design and layout, optimization, DV, and tape out
  • Work with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips
  • Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips
  • Interface and coordinate with multi-functional groups on new product package/SiP/module feasibility analysis, design, and selection
  • Define and develop design verification and automation strategy
  • Optimize package pin out and perform extraction of S-parameters and package RLGC model
  • Ensure package design is optimized with SI/PI requirements
  • Drive methodology, innovations, and efficiency improvements in package design
  • Explore, evaluate, and develop new CAD tools, design, and verification flow
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size

The ideal candidate will have:

  • BS degree and 3+ years of relevant industry experience
  • Fundamental knowledge in electrical/material/thermal/mechanical engineering
  • Familiarity with various sophisticated package configurations and assembly/substrate technology
  • Experience in package design and proficiency in Cadence Allegro platform tools or Mentor Xpedition platform tools
  • Basic understanding of SI/PI tools, package model extraction, S-parameters, and RLGC model
  • Knowledge of substrate manufacturing process, structure, design rules, and material property
  • Understanding of high-speed interfaces
  • Experience with Unix environment and scripting languages

This role offers the opportunity to work on cutting-edge technology and contribute to the development of Apple's iconic products. Join Apple's Hardware Technology Packaging team and be part of creating extraordinary products that shape the future of consumer electronics.

Last updated 25 days ago

Responsibilities For IC Package Design Engineer

  • Implement physical design of packages and modules for SoC, Memory, RF, and cellular chips
  • Interface and coordinate with multi-functional groups on new product package/SiP/module feasibility analysis, design, and selection
  • Define and develop design verification and automation strategy
  • Optimize package pin out and perform extraction of S-parameters and package RLGC model
  • Ensure package design is optimized with SI/PI requirements
  • Drive methodology, innovations, and efficiency improvements in package design
  • Explore, evaluate, and develop new CAD tools, design, and verification flow
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size

Requirements For IC Package Design Engineer

Python
  • BS degree and 3+ years of relevant industry experience
  • Fundamental knowledge in electrical/material/thermal/mechanical engineering
  • Familiarity with various sophisticated package configurations and assembly/substrate technology
  • Experience in package design and proficiency in Cadence Allegro platform tools or Mentor Xpedition platform tools
  • Basic understanding of SI/PI tools, package model extraction, S-parameters, and RLGC model
  • Knowledge of substrate manufacturing process, structure, design rules, and material property
  • Understanding of high-speed interfaces
  • Experience with Unix environment and scripting languages (PERL, Python, TCL, or shell)

Interested in this job?

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