Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Senior Staff R&D Engineer for Advanced Technology Development in Penang, Malaysia. This role combines deep technical expertise in IC packaging with leadership opportunities in advanced node silicon products (5nm, 3nm, 2nm and beyond). The position involves working at the cutting edge of semiconductor packaging technology, collaborating with cross-functional teams to design and implement innovative packaging solutions.
The role requires expertise in signal integrity, power integrity, and thermal management for high-performance semiconductor packages. You'll be responsible for developing and implementing new materials and processes, managing projects from concept through production, and working directly with tier #1 customers on custom ASIC programs. The position demands a strong background in materials science, electrical engineering, or mechanical engineering, with significant experience in advanced packaging technologies.
This is an excellent opportunity for an experienced professional looking to work with cutting-edge technology in semiconductor packaging. The role offers exposure to the latest advances in silicon node products and the chance to contribute to innovative solutions in the semiconductor industry. The position requires both technical depth and leadership skills, as you'll be interfacing with various stakeholders including customers, suppliers, and internal teams.
The ideal candidate will have a proven track record in semiconductor packaging, demonstrated through publications or patents, and the ability to drive innovation in multiple disciplines including manufacturing, materials, electrical, thermal, and mechanical aspects of IC packaging. This role offers the opportunity to work on challenging technical problems while developing and implementing solutions that impact the future of semiconductor technology.