Taro Logo

R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

A global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
George Town, Penang, Malaysia
Embedded
Staff Software Engineer
In-Person
5,000+ Employees
8+ years of experience
AI · Enterprise SaaS
This job posting may no longer be active. You may be interested in these related jobs instead:
GPU Power firmware development engineer- Sr Lead

Senior Lead GPU Power Firmware Development Engineer position at Qualcomm, focusing on developing and optimizing GPU system level power and control firmware for ARM Cortex M3 platforms.

Engineer, Staff Systems - Cork, Ireland

Staff Systems Engineer role at Qualcomm focusing on sensor-based technology for navigation, gaming, and AR/VR applications.

BT - Design Verification Sr Lead Engineer

Senior Lead Design Verification Engineer position at Qualcomm Bangalore, focusing on Bluetooth hardware verification for mobile and IoT chipsets.

ASICS Design Engineer, Up to Staff Level

ASICS Design Engineer position at Qualcomm focusing on ARM/RISC-V CPU subsystem development, requiring expertise in computer architecture and ASIC design flow.

Automotive Infotainment and ADAS Hardware Applications Engineer - Sr. Staff

Senior Staff Hardware Applications Engineer position at Qualcomm, focusing on automotive infotainment and ADAS systems, requiring extensive hardware design and customer support experience.

Description For R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Senior Staff R&D Engineer for Advanced Technology Development in Penang, Malaysia. This role combines deep technical expertise in IC packaging with leadership opportunities in advanced node silicon products (5nm, 3nm, 2nm and beyond). The position involves working at the cutting edge of semiconductor packaging technology, collaborating with cross-functional teams to design and implement innovative packaging solutions.

The role requires expertise in signal integrity, power integrity, and thermal management for high-performance semiconductor packages. You'll be responsible for developing and implementing new materials and processes, managing projects from concept through production, and working directly with tier #1 customers on custom ASIC programs. The position demands a strong background in materials science, electrical engineering, or mechanical engineering, with significant experience in advanced packaging technologies.

This is an excellent opportunity for an experienced professional looking to work with cutting-edge technology in semiconductor packaging. The role offers exposure to the latest advances in silicon node products and the chance to contribute to innovative solutions in the semiconductor industry. The position requires both technical depth and leadership skills, as you'll be interfacing with various stakeholders including customers, suppliers, and internal teams.

The ideal candidate will have a proven track record in semiconductor packaging, demonstrated through publications or patents, and the ability to drive innovation in multiple disciplines including manufacturing, materials, electrical, thermal, and mechanical aspects of IC packaging. This role offers the opportunity to work on challenging technical problems while developing and implementing solutions that impact the future of semiconductor technology.

Last updated 5 days ago

Responsibilities For R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

  • Work with business unit marketing and IC design teams to select optimum package solutions
  • Design custom packages with IC design, system design, package SI/PI & thermal engineering teams
  • Ensure packages meet CPI, SI/PI, and thermal requirements
  • Research, develop, and productize new materials for advanced node silicon
  • Manage IC packaging from concept through development, qualification and production
  • Create package design documentation and assembly instructions
  • Interface with packaging assembly and substrate suppliers
  • Support NPI bring-up, package qualification, and production support
  • Work with QA and customers to resolve quality issues

Requirements For R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

  • BS+8 years, MS+6 years, or PhD+3 years in STEM/Material Science/Electrical/Mechanical Engineering
  • Deep understanding of signal integrity and power integrity concepts
  • Strong authority on Cadence APD for custom substrate design
  • Expertise in advanced assembly processes for flipchip, MCM packages, and 2.5D
  • Good understanding of materials related to Chip Packaging Interaction
  • Knowledge of advanced substrate manufacturing/process
  • Strong project management, communication and leadership skills
  • Knowledge of GD&T and mechanical drawings
  • Understanding of manufacturing and quality engineering fundamentals
  • Track record of innovation through publications and/or patents desired

Interested in this job?