Interposer Physical Design Engineer

Google is seeking an Interposer Physical Design Engineer to join their Technical Infrastructure team. This role involves developing custom silicon solutions for Google's direct-to-consumer products, pushing boundaries in hardware experiences. The ideal candidate will have extensive experience in ASIC physical design, interposer routing, and advanced packaging technologies.

Key responsibilities include owning interposer routing for 2.5D or 3D packaging, connecting high-speed interfaces, performing ASIC top-level I/O planning, and collaborating with various design teams. The role requires expertise in advanced process nodes, layout, physical verification, and industry-standard tools.

Qualifications include a Bachelor's degree in a relevant field and 10 years of experience in ASIC physical design. Preferred qualifications involve experience in leading interposer or package design aspects, knowledge of semiconductor device physics, and understanding of thermal considerations for 3D stacked dies.

This position offers a competitive salary range of $177,000-$266,000, plus bonus, equity, and benefits. Google is committed to diversity, equal opportunity, and creating a culture of belonging. Join a team that's proud to be "engineers' engineers" and contribute to the architecture behind Google's vast product portfolio.