Senior Package Layout Engineer - Hardware

NVIDIA is seeking a hard-working Senior Package Layout Engineer committed to making a difference in the world through their contributions. This position will collaborate with Technical Package Lead and different design teams in the design and development of complex, detailed layout of IC substrates for NVIDIA products. The role involves working with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

Key responsibilities include:

• Collaborating to implement high speed/density ASIC packages
• Performing substrate breakout patterns for ASIC packages
• Optimizing package pinout incorporating system level trade-offs of pins assignment
• Helping perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
• Proposing layout design trade-offs to the Technical Package Lead
• Conducting design feasibility studies
• Developing symbols and CAD library databases using Cadence APD design tools
• Developing methodologies to improve layout productivity

Requirements:

• B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
• Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages (preferred)
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Validated working knowledge of high-speed design signal integrity practices
• Experience using Valor is helpful

NVIDIA offers competitive compensation, including equity and comprehensive benefits. The company values diversity and is an equal opportunity employer.