Qualcomm is seeking a Senior SIPI (Signal Integrity and Power Integrity) Engineer to join their Package Electrical Team. The role involves working with package and IC designers to optimize overall package design, ensuring system-level constraints are met prior to package Tape-out. Key responsibilities include performing package extraction for time and frequency domain analysis, conducting system-level analysis for DDR, SerDes & Mixed signal interfaces, providing design guidelines, developing design & analysis flow, and creating technical documentation. The ideal candidate will have 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to mobile standards, a strong background in Electromagnetics and transmission line theory, proficiency in field solvers and simulation tools, and working knowledge of Cadence Allegro/APD/Sip or Mentor Xpedition. Additional preferred qualifications include experience in programming languages, Matlab automation, and familiarity with design specifications such as LPDDRx, MIPI, PCIe, and UFS. A Master's Degree with 3-4 years of experience is preferred, though Ph.D. candidates with minimal experience will also be considered. Qualcomm offers a supportive, inclusive culture and comprehensive benefits, fostering an environment where employees can contribute to world-changing innovations and breakthrough technologies.