Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
Description For Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
SpaceX, a pioneering space exploration company, is seeking a Principal IC Packaging Test Engineer for their Starlink division. This role represents a unique opportunity to join the world's most advanced broadband internet system project, which currently serves over 4 million users globally.
The position is part of SpaceX's vertical integration initiative, bringing integrated circuit packaging and assembly in-house for both development and manufacturing. This strategic move aligns with SpaceX's mission to make space technology and global internet connectivity more accessible and affordable.
As a Principal IC Packaging Test Engineer, you'll be at the forefront of semiconductor technology, working with cutting-edge test equipment and collaborating with chip & system designers. The role demands expertise in semiconductor packaging and wafer testing, with responsibilities spanning from equipment definition to implementation of advanced testing solutions.
The ideal candidate brings 15+ years of industry experience in microelectronics packaging development, complemented by strong programming skills in languages like C++, Python, and Visual. Your expertise should cover digital, high-speed RF semiconductor test programs, wafer sort, probe card design, and parametric testing.
This position offers the opportunity to work on technology that's literally changing the world, from enabling global internet access to supporting SpaceX's ultimate goal of making humanity a multi-planetary species. You'll be part of a team that's known for pushing boundaries and achieving what others consider impossible.
The role requires a commitment to excellence and flexibility with working hours when needed for critical missions. Located in Bastrop, TX, this position is perfect for someone who wants to be part of a revolutionary company that's not just talking about the future, but actively building it.
Responsibilities For Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
- Own electrical test equipment definition for packaging and wafer level production testing
- Bring-up of test equipment and test programs for mass manufacturing
- Create automated test equipment (ATE) test programs and test plans
- Define full and comprehensive testing requirements to ensure product conformance
- Schematic and electrical review for all test equipment
- Supplier test interface for implementing new features, cost, and productivity improvements
- Implement advanced testing solutions for SpaceX next generation products
Requirements For Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
- Bachelor's degree in electrical engineering, software, computer & systems, physics, or other applied engineering discipline
- 10+ years of Programming experience in C/C++/Visual/Python
- 15+ years industry experience with microelectronics packaging development
- Expertise in developing digital, high-speed and RF semiconductor test programs for production
- Strong RF test knowledge
- Experience with digital, high speed SERDES, RF, and mixed signal testing
- Wafer sort, wafer probe, probe card design and test experience
- Custom socket and wafer prober design and test experience
- Semiconductor functional and parametric test design and development
- Digital waveform and test plan programming development
- Ability to work extended hours or weekends as needed for mission critical deadlines
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