I applied online and, in the next few days, received a call from the recruiter. After a few weeks, a telephonic interview was scheduled. One week later, I was called in for a face-to-face interview, which consisted of multiple rounds.

Round 1: Telephonic, related to the skills for which you applied. This is mostly a screening round.

Round 2: This round contains at least 3-4 sub-rounds conducted by different panelists, and all are typically held on the same day. For me, these were:

• Design & Architecting skills
• Specific skills for the technology opening
• Data structures, etc.
• Hiring manager interview

Data structures, skills specific, designing & architecting solutions, etc.