Great experience and great people
Great experience and great people
The people are great, the structure of the teams works well, and the work-life balance is good.
Amenities are very helpful, and the Redmond campus is very nice.
Sometimes the work can seem quite small; however, that would change as you take on more responsibility and move beyond an internship.
Additional Ratings
Was this helpful?
Microsoft Interview Questions
Microsoft Interview Experiences
Software Engineer II
A multi-round interview that generally takes the whole day. Each interviewer will ask a series of questions, and at least one interviewer will have you complete a coding problem on the whiteboard.
Software Engineer (Internship)
It was great! I was asked a hard LeetCode question, though. It was challenging, but I was able to get through some of it. I would suggest looking at common LeetCode questions before going to that interview.
Software Development Engineer (SDE) II
This was in January 2020. The process was a phone call with an easy string question, followed by a full-day interview that included LeetCode medium problems and questions about previous work. There was no system design. The final round featured 3D ma
Software Engineer II
Redmond, Washington, United StatesOctober 1, 2011A multi-round interview that generally takes the whole day. Each interviewer will ask a series of questions, and at least one interviewer will have you complete a coding problem on the whiteboard.
Software Engineer (Internship)
Redmond, Washington, United StatesApril 1, 2022It was great! I was asked a hard LeetCode question, though. It was challenging, but I was able to get through some of it. I would suggest looking at common LeetCode questions before going to that interview.
Software Development Engineer (SDE) II
Redmond, Washington, United StatesAugust 27, 2026This was in January 2020. The process was a phone call with an easy string question, followed by a full-day interview that included LeetCode medium problems and questions about previous work. There was no system design. The final round featured 3D ma
