Lots of learning opportunities. Good benefits.
The workload can be heavy.
The interview process involved a telephonic screening, followed by 5 rounds with the India team and 2 rounds with the US team. Questions ranged from protocol questions, C++ problem-solving, embedded systems questions, and puzzles.
It comprises three levels: two technical and one HR. 1. The first technical round covered basics you studied and your project. 2. The second round was about the profile you might be allotted. In my case, it was GPU design and verification. 3. The HR
The initial phone interview was very basic and relatively short, lasting 30 minutes. Questions ranged from basic EE 101 type to synthesis issues. It was conducted by another engineer on the hiring team, not the hiring manager.
The interview process involved a telephonic screening, followed by 5 rounds with the India team and 2 rounds with the US team. Questions ranged from protocol questions, C++ problem-solving, embedded systems questions, and puzzles.
It comprises three levels: two technical and one HR. 1. The first technical round covered basics you studied and your project. 2. The second round was about the profile you might be allotted. In my case, it was GPU design and verification. 3. The HR
The initial phone interview was very basic and relatively short, lasting 30 minutes. Questions ranged from basic EE 101 type to synthesis issues. It was conducted by another engineer on the hiring team, not the hiring manager.