Interviewed in February 2021, the process began after being contacted by a recruiter. The interview structure was as follows:

• 45-minute introduction call with the recruiter
• 1-hour interview with a Senior Engineer
• Timed written exam (exact time not recalled, but believed to be 2 hours)
• 1-hour project presentation followed by 5 hours of panel interviews

Initial interviews focused on my background and experience, followed by very basic technical questions relevant to the position (e.g., cantilever beams, stress-strain charts).

The written exam was difficult, with questions seemingly designed to trick candidates and test their thought process. It was multiple choice, requiring a photo submission of the work. The score appeared to be less critical than the clarity and logical flow of the work. Therefore, a low "grade" should not be a major concern as long as the reasoning is sound and easy to follow.

The panel interview was the most challenging part of the process. I presented a project about a device designed during university to approximately 10 individuals. Following the presentation, a Q&A session of 15-30 minutes took place, covering aspects of the design as well as the technical background of the device.

After the initial questioning rounds, one-on-one interviews with members of the presentation audience commenced. Each interview seemed to focus on a specific theme, including solid mechanics, mechanical design, material science, and heat transfer.

The overall process was lengthy, with minimal breaks, and was almost entirely technical in nature.

How would you design an injection-molded latch mechanism?

What design constraints must you take into account when creating an injection-molded part?

Describe the stress-strain curves for steel, aluminum, and plastic.